Tin or zinc based, halide free, surface mount technology processing solder paste:
 
-with metal contents of 87,5 % or more, but not more than 90,1 % by weight,
 
-with an alloy solidus temperature of 210°C or more,
 
-with a viscosity of 178 Pa·s or more, but not more than 235 Pa·s,
 
-with a particle size of 40 µm or less,
 
-with a silver content either of 3,15 % or more, but not more than 3,5 % by weight for tin based paste or of 0,25 % or more, but not more than 0,28 % by weight for zinc based paste,
 
-with or without bismuth content of 2,55 % or more, but not more than 2,71 % by weight,
 
-with or without copper content of 0,6 % or more, but not more than 0,7 % by weight

Restriction on entry into free circulation
condition:B,certificate:9009,action:29|condition:B,certificate:9010,action:29|condition:B,certificate:9017,action:26|condition:B,action:09